CSP
Flip Chip Technology Chip Scale Package High Power CSP LED
Specification
Part Number |
Lead Frame |
Max Power [W] |
VF Range [V] |
Type VF |
Rated If |
CCT [K] @85℃ |
CCT Binning |
CRI |
LM flux [@85℃] |
|||
Typ. |
Max. |
Min. |
Max. |
Typ. |
||||||||
CSP2323 |
2323 |
4.2W |
2.65-3.0 |
2.85 |
350 |
1400 |
2200K |
ANSI 5SDCM/3SDCM |
70 |
240 |
270 |
250 |
2700K |
70 |
270 |
310 |
290 |
||||||||
3000K |
70 |
290 |
330 |
300 |
||||||||
3500K |
70 |
300 |
340 |
310 |
||||||||
4000K |
70 |
310 |
350 |
320 |
||||||||
5000K |
70 |
310 |
350 |
320 |
||||||||
5700K |
70 |
310 |
350 |
320 |
||||||||
6500K |
70 |
300 |
340 |
310 |
||||||||
CSP2323 |
2323 |
4.2W |
2.65-3.0 |
2.85 |
350 |
1400 |
2200K |
ANSI 5SDCM/3SDCM |
80 |
220 |
250 |
230 |
2700K |
80 |
240 |
280 |
260 |
||||||||
3000K |
80 |
250 |
290 |
270 |
||||||||
3500K |
80 |
270 |
310 |
290 |
||||||||
4000K |
80 |
280 |
320 |
300 |
||||||||
5000K |
80 |
280 |
320 |
300 |
||||||||
5700K |
80 |
280 |
320 |
300 |
||||||||
6500K |
80 |
280 |
320 |
300 |
||||||||
CSP2323 |
2323 |
4.2W |
2.65-3.0 |
2.85 |
350 |
1400 |
2200K |
ANSI 5SDCM/3SDCM |
90 |
170 |
210 |
190 |
2700K |
90 |
200 |
240 |
220 |
||||||||
3000K |
90 |
220 |
260 |
240 |
||||||||
3500K |
90 |
230 |
270 |
250 |
||||||||
4000K |
90 |
230 |
270 |
260 |
||||||||
5000K |
90 |
230 |
270 |
260 |
||||||||
5700K |
90 |
230 |
270 |
260 |
||||||||
6500K |
90 |
230 |
270 |
250 |
||||||||
Product Description
Introducing the CSP2323 LED chip, a cutting-edge product that combines the latest in LED technology with a compact and efficient design. Developed independently, this chip-scale package features a 57mil-Flipchip and the innovative "non-bracket" technology, along with a special phosphor film, to emit white light from a single side.
The CSP2323 is the ideal solution for outdoor high-power applications, offering perfect performance and reliability as a substitute for ceramic and EMC products. With LM80 certification, this LED is guaranteed to provide long-lasting, high-quality lighting.
One of the standout features of the CSP2323 is its chip-scale package, which offers a low thermal resistance and high performance, ensuring that the LED remains cool and efficient even during extended use. Its single-side emitting design makes it easy to integrate into a wide range of products, and is perfect for secondary optical design.
In addition, the CSP2323 features a smaller Light Emitting Surface (LES) and high optical density, providing a more focused and intense light output. The use of a special phosphor film technology also ensures better color uniformity, creating a natural and consistent white light.
Furthermore, the CSP2323 is designed to support all SMT assembly and solder processes, making it easier than ever to integrate into your production line. With its compact size and high performance, this LED offers a flexible and practical solution for a wide range of lighting applications.
In conclusion, the CSP2323 LED chip offers a combination of advanced technology, compact design, and high performance. With its chip-scale package, single-side emitting design, and special phosphor film technology, this LED is the perfect choice for outdoor high-power applications, providing reliable and efficient lighting for a wide range of products. Say goodbye to bulkier ceramic and EMC products, and say hello to the future of LED lighting with the CSP2323.
Product Advantages
• Chip-scale package, low thermal resistance, high performance
• Single-side emitting, easy for secondary optical design
• Smaller LES and high optical density
• Special phosphor film technology, better color uniformity
Key Features
• Advanced flip chip technology, chip scale packaging technology
• High CRI, high brightness, high reliability
• Low thermal resistance
• Long operation life span
• 2700K-7000K cool white, natural white and warm white color available
• ANSI-compatible chromaticity binning
• Supporting for all SMT assembly and solder process
• LM80 certified
• Environmental friendly, RoHS compliance
