Industry Breakthrough-- Company LEKIN, a collabration company with GALUX on GaN-on-Si LED technology

Industry Breakthrough-- Company LEKIN, a collabration company with GALUX on GaN-on-Si LED technology, released industry's first GaN-on-silicon full color Micro-LED on single chip ---- SiMiP ®, which empowered to micro LED display.

Technological Innovation: The way to break the game of large screen direct display

In recent years, COB packaging technology based on Mini LED chip has developed rapidly in the field of micro LED large-screen display. However, with the further minification of pixel spacing, the yield rate of Mini LED COB production plummeted. Micro-LED has become the best choice for the development of micro-spacing large-screen straight display technology. However, low yield rate and high cost of the massive transfer and repair of Micro-LED has seriously hindered the scale application of Micro-LED in the field of large screen display. The MiP technology was created to avoid the Micro-LED repair problem, but the MiP of adding a complex rewiring packaging process remains high cost.

Based on its own high-efficiency silicon-based GaN Micro-LED technology, aiming at the demand of cost-effective micro-spacing LED large screen display, LEKIN independently developed its single-core full-color SiMiP display chip technology. SiMiP is a high-order MiP technology that integrates red, green and blue three basic colors with a single core, and transfers the chip to the driving board without a complex massive transfer and repair process. This technology can greatly improve the first pass yield of micro spacing LED display module production, significantly reduce the production cost, together with the advantages of high performance and low cost, and provide a more competitive solution for micro LED large screen display applications.

SiMiP Core Advantage

1. Wafer level packaging: Thechip cut by SiMiP wafer is the MiP packaging structure, which can be directly transfer to die bonding, simplify the process and reduce the cost;
2. No massivetransfer: SiMiP single core integrates red, green and blue three color elements  chips, which can use the mature high yield and low cost Pick & Place die bonding process to transfer the chip to the driving board without complex massive transfer technology, which greatly improving the first pass yield;
3. Red, green, and blue, three color in one:SiMiP chip realizes red and green light emitting through color conversion materials, but not with the traditional red and green light emitting chip, which not only reduces the cost, but also avoids the toxic materials used in the production of traditional four elements red color chip, which is more environmentally friendly.
4. Good consistency: SiMiP chip realizes single-core full color integration through silicon-based blue light Micro-LED and its self-developed color conversion technology.The red and green emitting elements have high consistency and stability on working voltage, light distribution and  luminous wavelength. The luminous wavelength of red and green elements does not change with the working current and temperature difference, and the light distribution is not easy to be disturbed by die bonding deviation, which solves the color bias problem of the traditional scheme from the root;

Global patent layout + Vehicle regulation level production guarantee

Patent barriers: LEKIN has strong patent assets, including thousands of acquired and own patents, realizing the global coverage of patents in Europe, America, Japan and South Korea, and laying a solid foundation for overseas competition. The patent cover the whole industry chain of epitaxy, chip, packaging, module and application, and maintains an absolute leading advantage in micro-LED display, matrix pixelated smart car headlights, UV curing and sterilization, and medical and health care fields.

Quality assurance: IATF16949 qualified vehicle standard modern production management system, escort a high product quality and reliability.